Who builds the compute stack

Korean 8-inch specialty foundry for power management, analog and sensor ICs.

Sources: DB HiTek website · Wikipedia, DB HiTek (KRX 000990)

Specialty foundry with fabs in the US, Germany and Singapore; bought Synopsys' ARC processor IP in 2026.

Sources: GlobalFoundries website · GF press release via Nasdaq, Jun 2026

Shanghai specialty foundry for power, embedded non-volatile memory and analog chips.

Sources, partly verified: Quartr, Hua Hong (1347) Q2 2026 · TrendForce, Jan 2026 (Huali acquisition)

Intel's foundry unit offering 18A and 14A processes and EMIB/Foveros packaging to external customers.

Sources, partly verified: Bits&Chips (Intel Foundry subsidiary structure)

Hefei foundry specializing in display driver ICs and mature-node logic.

Sources: Nexchip website · Crypto Briefing (Bloomberg), Jul 2026 · HKEX trading arrangement notice, code 2249

Taiwanese foundry making logic, DRAM and flash on mature nodes.

Sources: PSMC website · StockAnalysis, TPE:6770 · StorageNewsletter, Mar 2026 (Tongluo P5 sold to Micron)

Government-backed Japanese foundry targeting 2nm mass production in Hokkaido from 2027.

Sources: Rapidus website · Evertiq, Jun 2026

Contract chipmaking business of Samsung Electronics; second-largest foundry by revenue in 2Q26.

Sources: Samsung Semiconductor website · TrendForce 2Q26 foundry ranking, Sep 2026

Malaysian 8-inch CMOS and MEMS foundry in Kulim.

Sources: SilTerra website · The Star, Oct 2026 · The Edge Malaysia (DNeX 60% stake)

US trusted foundry; acquired Infineon's Austin Fab 25 in June 2025.

Sources: SkyWater website · SkyWater press release, Jun 2025

China's largest foundry and third-largest globally by revenue in 2Q26.

Sources: SMIC website · Wikipedia, SMIC (SSE 688981 / SEHK 981) · TrendForce 2Q26 foundry ranking, Sep 2026

Specialty analog foundry for RF, silicon photonics, power and imaging, with fabs in Israel, US and Japan.

Sources: Tower Semiconductor website · StockAnalysis, NASDAQ/TASE: TSEM · RTTNews, Mar 2026 (TPSCo restructuring)

World's largest pure-play foundry, with about 72.5% of top-10 foundry revenue in 2Q26.

Sources: TSMC website · StockAnalysis, NYSE: TSM · TrendForce 2Q26 foundry ranking, Sep 2026

Taiwanese foundry focused on mature and specialty process nodes of 28nm and above.

Sources: UMC website · StockAnalysis, TPE:2303 · Rallies.ai, 2026 (GF merger only speculation)

Taiwanese specialty foundry building a 12-inch joint-venture fab (VSMC) in Singapore with NXP.

Sources: VIS website · NXP newsroom, VSMC fab opening, Sep 2026

Analog/mixed-signal, MEMS and SiC specialty foundry for automotive and industrial markets.

Sources: X-FAB website · Euronext, X-FAB Q1 2026 results

Optical sensors, emitters and LED semiconductors.

Sources: StockAnalysis, SIX: AMS · ams OSRAM AGM 2026 release

High-performance analog, data converter and power chipmaker; acquired Empower Semiconductor in 2026.

Sources: StockAnalysis ADI profile · Pulse 2.0, Jul 2026 (Empower close) · DCD, May 2026

Automotive chips, MEMS sensors and SiC devices from fabs in Germany and California.

Sources, partly verified: Bosch semiconductors & sensors site

State-owned Chinese power-discrete and analog chipmaker that also offers foundry services.

Sources: StockAnalysis 688396 profile

Discrete, analog and mixed-signal standard semiconductor products.

Sources: StockAnalysis DIOD profile

Makes IGBT modules and power semiconductors for industrial and automotive uses.

Sources: StockAnalysis 6504 profile

Largest automotive and power semiconductor maker, covering Si, SiC and GaN devices and MCUs.

Sources: StockAnalysis IFX profile

Largest US logic chipmaker, designing and making PC and server CPUs; runs Intel Foundry as a subsidiary.

Sources: StockAnalysis INTC profile · Intel investor relations

Microcontroller, FPGA and analog chipmaker; completed its acquisition of edge-AI chip firm Hailo in September 2026.

Sources: StockAnalysis MCHP profile · Nasdaq, Sep 2026 (Hailo close) · Edge AI Vision, Jul 2026

Major supplier of IGBT and SiC power modules for rail, industrial and EV uses.

Sources: StockAnalysis 6503 profile

Discretes, logic and MOSFET maker; under Dutch trustee control amid a dispute with owner Wingtech.

Sources: Caixin, Feb 2026 · Nexperia press release

Automotive, industrial and IoT processors, microcontrollers and connectivity chips.

Sources: StockAnalysis NXPI profile

Power semiconductors (SiC, IGBTs) and image sensors for automotive and industrial markets.

Sources: StockAnalysis ON profile

Leading supplier of microcontrollers and automotive SoCs, plus analog and power chips.

Sources: StockAnalysis 6723 profile

Japanese power and analog chipmaker that owns SiC substrate supplier SiCrystal.

Sources: StockAnalysis 6963 profile · Evertiq, May 2026 (Denso bid withdrawn)

Hangzhou chipmaker of power devices, MEMS sensors and LEDs.

Sources: StockAnalysis 600460 profile

RF front-end and mixed-signal chipmaker; completed its merger with Qorvo in October 2026.

Sources: StockAnalysis SWKS profile · Verdict, Oct 2026 · Skyworks release via Morningstar

World's leading maker of CMOS image sensors.

Sources: Sony Semiconductor Solutions site

Franco-Italian chipmaker of microcontrollers, analog, SiC power devices and sensors.

Sources, partly verified: StockAnalysis STM profile

World's largest analog chipmaker; agreed in February 2026 to acquire Silicon Labs.

Sources: StockAnalysis TXN profile · MBT Mag, Feb 2026 (Silicon Labs deal)

Toshiba's power discretes, analog IC and hard-disk-drive business.

Sources, partly verified: Toshiba Electronic Devices & Storage site · BusinessWire, Mar 2026 (HDD launch)

Discrete semiconductors such as MOSFETs and diodes, plus passive components.

Sources: StockAnalysis VSH profile

Silicon carbide wafers and power devices; emerged from Chapter 11 in September 2025.

Sources: StockAnalysis WOLF profile · Wolfspeed FY2026 annual report (SEC)

China's leading DRAM maker in Hefei; listed on Shanghai's STAR Market in July 2026.

Sources: CXMT website · Deloitte China, Jul 2026 (688825.SH)

Former Toshiba Memory; makes BiCS 3D NAND in a joint venture with SanDisk.

Sources: Kioxia website · StockAnalysis, TYO:285A · The Star (Bloomberg), Sep 2026

NOR flash leader that also makes SLC NAND and ROM products.

Sources: Wikipedia, Macronix (TWSE 2337)

Only US-based DRAM and NAND maker; rose to third in NAND in 2Q26.

Sources: Micron website · Micron IR press release, Mar 2026 · TrendForce 2Q26 NAND ranking, Aug 2026

Formosa Plastics Group's DRAM maker for specialty and commodity DRAM.

Sources: Nanya website · StockAnalysis, TPE:2408

Memory business of Samsung Electronics; world's largest DRAM maker with 39.4% share in 2Q26.

Sources: Samsung Semiconductor website · TrendForce 2Q26 DRAM ranking, Sep 2026

NAND flash and SSD company spun off from Western Digital in February 2025.

Sources: SanDisk website · StockAnalysis, NASDAQ: SNDK · TrendForce 2Q26 NAND ranking, Aug 2026

Second-largest DRAM maker and HBM leader; owns SSD maker Solidigm.

Sources: SK hynix website · CNBC, Jul 2026 · GraniteShares (ticker SKHY)

NAND SSD maker formed from Intel's former NAND business.

Sources: Solidigm website · InvestingLive, Oct 2026 (IPO plan dropped)

Specialty DRAM, NOR and SLC NAND flash for consumer, automotive and industrial uses.

Sources: Winbond website · StockAnalysis, TPE:2344

China's leading 3D NAND maker in Wuhan; STAR Market IPO under review, targeting 1H 2027.

Sources: YMTC website · The Star (Reuters), Aug 2026

ASIC design-services house for AI and HPC custom chips at TSMC advanced nodes.

Sources: Alchip official site · Alchip (Wikipedia)

Fab-lite designer of magnetic sensor and power ICs for automotive and industrial motion control.

Sources: Allegro MicroSystems official site · ALGM quote, StockAnalysis

Designs Agilex, Stratix and Cyclone FPGAs; spun out of Intel with Silver Lake as majority owner.

Sources: Silver Lake 51% stake closing, Sep 2025 · Altera (Wikipedia)

Designs AI vision SoCs for automotive, security cameras and robotics.

Sources: Ambarella official site · AMBA quote, StockAnalysis · Investing.com, NXP talks report, Jul 2026

Designs EPYC and Ryzen CPUs, Instinct GPUs and FPGAs; agreed to acquire Taalas in August 2026.

Sources: AMD newsroom, Taalas agreement, Aug 2026 · AMD quote, StockAnalysis

Designs Arm-based AmpereOne server processors; acquired by SoftBank for $6.5B in November 2025.

Sources: Ampere press release, acquisition completed · Bloomberg, Nov 2025

Designs PCIe, CXL and Ethernet retimers, fabric switches and memory controllers for AI racks.

Sources: Astera Labs official site · ALAB quote, StockAnalysis

Amazon unit designing Graviton CPUs, Trainium and Inferentia AI chips and Nitro DPUs.

Sources, partly verified: AWS silicon innovation page

Designs Ethernet switch chips, custom AI accelerators, broadband and wireless chips; also infrastructure software.

Sources: Broadcom official site · AVGO quote, StockAnalysis

Designs low-power audio codecs, amplifiers, haptics and power ICs, mainly for smartphones.

Sources: Cirrus Logic investor relations · CRUS quote, StockAnalysis

Designs SerDes, active electrical cables, optical DSPs and retimers for AI data centers.

Sources: Credo official site · CRDO quote, StockAnalysis

UMC-affiliated ASIC design-services and silicon IP provider.

Sources: Faraday Technology official site · Faraday Technology (Wikipedia)

Designs NOR flash, niche DRAM and GD32 MCUs; added a Hong Kong listing in January 2026.

Sources: GigaDevice news, HKEX listing Jan 2026 · HKEX trading arrangement notice, 3986

TSMC-affiliated ASIC design-services and IP company for advanced-node and CoWoS/HBM chips.

Sources, partly verified: GUC official site (IR code 3443)

Google's in-house team designing TPU AI accelerators and Axion Arm CPUs.

Sources, partly verified: Google Cloud TPU page

Designs display-driver ICs, timing controllers, WiseEye AI sensing and optics.

Sources: Himax official site · HIMX quote, StockAnalysis

Huawei's chip design unit for Kirin mobile SoCs and Kunpeng server CPUs.

Sources: HiSilicon official site · HiSilicon (Wikipedia)

Designs x86-compatible server CPUs and DCU AI accelerators; cancelled its Sugon merger in December 2025.

Sources: Hygon official site · The Register, Dec 2025 · Hygon (Wikipedia)

Designs low-power small and mid-range FPGAs for edge, industrial, automotive and data-center uses.

Sources: Lattice official site · LSCC quote, StockAnalysis

Designs domestic LoongArch-architecture CPUs for PCs, servers and industrial control.

Sources: Loongson official site · Loongson (Wikipedia)

Designs data-center optical DSPs, custom AI ASICs and switches; acquired Celestial AI in February 2026.

Sources: Marvell IR, Celestial AI completed, Feb 2026 · MRVL quote, StockAnalysis

Designs broadband, Wi-Fi, Ethernet and optical PAM4 DSP chips.

Sources: MaxLinear official site · MXL quote, StockAnalysis

Designs Dimensity smartphone SoCs plus TV, Wi-Fi, automotive and custom ASIC chips.

Sources: MediaTek official site · MediaTek (Wikipedia)

Meta team designing MTIA training and inference accelerators for its own data centers.

Sources, partly verified: Meta AI blog, MTIA

Microsoft team designing Maia AI accelerators and Cobalt Arm server CPUs.

Sources, partly verified: Microsoft Source, Maia and Cobalt

Designs power-management ICs and modules for data-center, automotive and industrial markets.

Sources: MPWR quote, StockAnalysis · Monolithic Power Systems (Wikipedia)

Designs DDR5 memory interface chips, CXL memory expanders and PCIe retimers; listed in Hong Kong in 2026.

Sources: Montage official site · The Standard, HK debut Feb 2026

Designs GaN and SiC power semiconductors for AI data centers, EVs and chargers.

Sources: Navitas official site · NVTS quote, StockAnalysis

Designs ultra-low-power Bluetooth LE, Thread/Matter, Wi-Fi and cellular IoT SoCs.

Sources: Nordic Semiconductor official site · Nordic Semiconductor (Wikipedia)

Designs display-driver ICs, timing controllers and TV/monitor SoCs.

Sources, partly verified: Novatek official site

Largest fabless chip company, designing GPUs, AI accelerators, Grace CPUs and data-center networking.

Sources: NVIDIA official site · NVDA quote, StockAnalysis

CMOS image sensor and display driver designer, renamed from Will Semiconductor in 2025; Hong Kong-listed January 2026.

Sources: OmniVision announcement, H-share listing Jan 2026 · Kirkland & Ellis, Jan 2026

Designs NAND flash controllers and SSD solutions.

Sources: Phison official site · Phison (Wikipedia)

Designs high-voltage AC-DC converter ICs, gate drivers and GaN power switches.

Sources: Power Integrations official site · POWI quote, StockAnalysis

Designs Snapdragon mobile, PC and automotive SoCs and modems; acquired Alphawave in December 2025.

Sources: Business Wire via Barchart, Alphawave completed Dec 2025 · QCOM quote, StockAnalysis

Designs DDR5 memory interface chips and licenses memory and security IP.

Sources: Rambus official site · RMBS quote, StockAnalysis

Designs Ethernet, Wi-Fi/Bluetooth, audio codec and PC/TV controller chips.

Sources: Realtek official site · Realtek (Wikipedia)

Designs LoRa IoT chips, data-center signal-integrity ICs and protection devices.

Sources: Semtech official site · SMTC quote, StockAnalysis · EE Asia, module sale to Compal, Aug 2026

Designs power-management and analog ICs; Taiwan-listed with operations mainly in Hangzhou.

Sources: Silergy official site · Silergy (Wikipedia)

Designs wireless IoT SoCs and MCUs; Texas Instruments agreed to buy it in February 2026.

Sources: TI 8-K press release, Feb 2026 · SLAB quote, StockAnalysis

Designs NAND flash controllers for SSDs, eMMC/UFS and portable storage.

Sources: Silicon Motion official site · SIMO quote, StockAnalysis

Custom SoC design company for automotive, data-center and consumer chips.

Sources: Socionext official site · Socionext (Wikipedia)

Designs edge-AI IoT processors, wireless, touch and display chips; onsemi agreed to buy it in June 2026.

Sources: Synaptics SEC Form 425, Jun 2026 · GlobeNewswire via Chartmill, Jun 2026 · SYNA quote, StockAnalysis

Designs low-cost smartphone, feature-phone and cellular IoT SoCs; preparing a STAR Market IPO.

Sources, partly verified: UNISOC official site · C114, IPO tutoring update Apr 2026

Metis edge AI accelerators based on digital in-memory computing.

Sources: Axelera AI website · Bloomberg, Feb 2026

In-package optical I/O chiplets (TeraPHY) and SuperNova light sources.

Sources: Ayar Labs newsroom

General-purpose GPUs for AI training and inference; listed in Hong Kong in January 2026.

Sources: Biren website · The Standard, Jan 2026 · Wikipedia: Biren Technology

Automotive autonomous-driving SoCs (Huashan, Wudang).

Sources: Black Sesame website · Wikipedia: Black Sesame Technologies

Graph Streaming Processor edge AI chips and software; listed via SPAC in January 2025.

Sources, partly verified: StockAnalysis: BZAI

Chinese designer of MLU-series AI accelerator chips for cloud and edge.

Sources: Cambricon website · Wikipedia: Cambricon Technologies

Photonic Fabric optical interconnect for compute-to-memory links; acquired by Marvell in February 2026.

Sources: Marvell press release, Feb 2026 · Marvell investor relations

Builds wafer-scale AI processors and CS-3 systems plus an inference cloud; IPO'd on Nasdaq in May 2026.

Sources: StockAnalysis: CBRS (IPO May 14, 2026) · Nasdaq newsroom, May 2026 · Wikipedia: Cerebras Systems

Scalable dataflow processors for fully homomorphic encryption and secure computing.

Sources, partly verified: Cornami website

Digital in-memory-compute inference accelerators (Corsair) and Squadron compute clusters for data centers.

Sources: d-Matrix newsroom

Charge-based analog in-memory-compute AI accelerators for client and edge devices.

Sources, partly verified: EnCharge AI website

Tencent-backed cloud AI training and inference accelerators; listed on the STAR Market in September 2026.

Sources: Eastmoney, Sep 2026 (688801 STAR debut) · Wikipedia: Enflame

Builds Sohu, a transformer-specific inference ASIC; raised $700M at a $21B valuation led by Jane Street.

Sources, partly verified: Etched website

Thermodynamic sampling units using probabilistic bits for generative AI.

Sources, partly verified: Extropic website

Develops in-memory-compute chips for fast LLM inference.

Sources, partly verified: Fractile website

Data-center inference NPUs (RNGD); turned down an $800M acquisition offer from Meta in 2025.

Sources: FuriosaAI newsroom (Series D, Oct 2026)

Intelligence Processing Unit (IPU) AI accelerator maker, owned by SoftBank since 2024.

Sources: Graphcore website (part of SoftBank Group) · Wikipedia: Graphcore

LPU inference chip maker running GroqCloud; NVIDIA licensed its technology and hired founder Jonathan Ross in December 2025.

Sources: Groq website · BNN Bloomberg, Dec 2025 · Wikipedia: Groq

Edge AI and vision processors; acquired by Microchip Technology in September 2026.

Sources: Microchip announcement (via StorageNewsletter), Jul 2026 · Wikipedia: Hailo Technologies (closed Sep 21, 2026) · Hailo website

Automotive driver-assistance and autonomous-driving SoCs (Journey) and software.

Sources: Horizon Robotics website · Wikipedia: Horizon Robotics

General-purpose GPUs for AI training and inference; listed in Hong Kong in January 2026.

Sources: Iluvatar CoreX website · Yicai Global, Jan 2026 · Wikipedia: Iluvatar CoreX

Baidu-controlled AI chip unit behind the Kunlun P800 accelerator.

Sources: Kunlunxin website · Wikipedia: Kunlunxin (Baidu subsidiary) · TechCentral, Jan 2026 (planned IPO)

Optical interconnect and photonic computing chips.

Sources, partly verified: Lightelligence website

Photonic interconnect (Passage) and photonic computing for AI data centers.

Sources: Lightmatter website

Ex-Google TPU engineers building high-throughput chips for large language models.

Sources, partly verified: MatX website

GPU maker for AI training and inference; listed on the STAR Market in December 2025.

Sources: MetaX website · Yicai Global, Dec 2025 · Wikipedia: MetaX

MUSA-architecture GPUs for AI, graphics and data centers; listed on the STAR Market in December 2025.

Sources: Moore Threads website · DealStreetAsia, Dec 2025 · Wikipedia: Moore Threads

Analog compute-in-memory AI processors; recapitalized after a 2023 near-collapse.

Sources, partly verified: Mythic website

Thermodynamic AI computing chips and AI tools for chip design.

Sources, partly verified: Normal Computing website

Energy-efficient transformer inference hardware for data centers; raised an $875M Series C at a $5B valuation.

Sources, partly verified: Positron website

Photonic quantum computer chips manufactured at GlobalFoundries.

Sources: PsiQuantum website · Wikipedia: PsiQuantum

Data-center AI inference NPUs; merged with Sapeon in 2024 and raised a $400M pre-IPO round in 2026.

Sources: Rebellions newsroom

Superconducting quantum processors made in its own fab.

Sources: Rigetti website · Wikipedia: Rigetti Computing

RISC-V CPU and AI accelerator SoCs for data centers; acquired by Meta in late 2025.

Sources, partly verified: DatacenterDynamics, 2025 · Tech Startups, Jun 2026 (deal closed)

Reconfigurable dataflow AI chips and inference platforms; raised a $350M Series E in February 2026.

Sources: SambaNova website · Wikipedia: SambaNova Systems

Machine-learning SoCs (MLSoC, Modalix) for embedded edge and physical AI.

Sources, partly verified: SiMa.ai website

Hardwires specific AI models into custom inference silicon; AMD agreed to acquire it in August 2026.

Sources: AMD press release, Aug 2026 · Taalas website

Develops logarithmic-math inference systems for data centers.

Sources, partly verified: Tensordyne website

RISC-V-based AI processors and licensable CPU and AI IP, led by Jim Keller.

Sources, partly verified: Tenstorrent about page

High-performance RISC-V server CPU chiplets (Veyron); acquired by Qualcomm in December 2025.

Sources, partly verified: DatacenterDynamics, Dec 2025 · Evertiq, Dec 2025

High-speed SerDes connectivity IP and chiplets; acquired by Qualcomm in December 2025.

Sources: Qualcomm press release, Dec 2025

RISC-V CPU IP vendor and founding member of RISC-V International.

Sources: Andes Technology website · StockAnalysis, TPE:6533 · Wikipedia

Dominant CPU architecture licensor; launched its first in-house chip, the AGI CPU, in March 2026.

Sources: Wikipedia (Nasdaq: ARM; SoftBank 86.4%) · The Decoder, Mar 2026

Major EDA, IP and system simulation vendor; acquired Hexagon's Design & Engineering business in February 2026.

Sources: Cadence investor relations · Cadence press release, Feb 2026

Licenses wireless connectivity, DSP and edge AI NPU IP.

Sources, partly verified: Wikipedia (Nasdaq: CEVA, Rockville MD)

Agentic AI platform for RTL design and verification.

Sources: ChipAgents website · Evertiq, Aug 2026

Physics-informed AI foundation model for chip design; raised a $60M Series A in April 2026.

Sources: Cognichip website · Built In, Apr 2026

China's largest domestic EDA vendor for analog, flat-panel display and foundry tools.

Sources: Empyrean website (stock code 301269)

GPU and AI accelerator IP licensor owned by Canyon Bridge, which put it up for sale.

Sources, partly verified: Imagination website · Wikipedia (owner Canyon Bridge) · SDxCentral (sale process)

RF, high-speed digital and photonic design software; added Synopsys' Optical Solutions Group in 2025.

Sources: Keysight EDA software page · Keysight press release, Oct 2025

RISC-V CPU IP unit of GlobalFoundries; absorbed Synopsys' ARC processor IP business in June 2026.

Sources: MIPS press release, Jun 2026

Chinese device modeling, SPICE simulation and yield EDA vendor expanding into IP.

Sources: Primarius website · StockAnalysis, SHA:688206

Former Mentor Graphics, offering Calibre verification, Questa, Tessent and PCB tools; Siemens also acquired Altair in 2025.

Sources, partly verified: Wikipedia (Wilsonville OR; part of Siemens)

RISC-V CPU and AI/vector core IP leader; raised a $400M Series G in April 2026.

Sources: SiFive website · The Next Web, Apr 2026

TCAD, analog/mixed-signal EDA and foundation IP vendor; IPO'd in May 2024.

Sources, partly verified: Wikipedia (Nasdaq: SVCO; IPO May 2024)

Largest EDA and interface IP vendor; acquired Ansys in July 2025 and sold ARC processor IP in 2026.

Sources: Wikipedia (Nasdaq: SNPS; Ansys closed Jul 17, 2025) · MIPS/GF press release, Jun 2026 (ARC sale)

Wafer cleaning, electroplating and furnace tools, operating largely through ACM Shanghai.

Sources: StockAnalysis ACMR profile · Wikipedia: ACM Research

Precision RF and DC power delivery subsystems for plasma processes.

Sources: StockAnalysis AEIS profile · Wikipedia: Advanced Energy

Largest automated test equipment vendor for SoC and memory chips.

Sources: Advantest investor relations · StockAnalysis Advantest profile

MOCVD deposition systems for GaN, SiC and compound semiconductors.

Sources: StockAnalysis Aixtron profile · Aixtron investor relations

Chinese plasma etch and MOCVD equipment supplier.

Sources: StockAnalysis AMEC profile · Wikipedia: AMEC

Largest broad-line wafer equipment maker; raising its Besi stake to about 20% in 2026.

Sources: StockAnalysis AMAT profile · Applied Materials 8-K, Oct 2026 (Besi stake)

Market leader in atomic layer deposition (ALD) and epitaxy equipment.

Sources: StockAnalysis ASM International profile · Wikipedia: ASM International

Sole supplier of EUV lithography systems; also leads in DUV scanners and computational lithography.

Sources: Wikipedia: ASML · ASML website

Back-end assembly, thermo-compression bonding and SMT placement equipment.

Sources: ASMPT investor relations · StockAnalysis ASMPT profile

Ion implantation specialist strong in SiC and power; Veeco merger expected to close by Q1 2027.

Sources: StockAnalysis ACLS profile · Axcelis 8-K, Nov 2026 (merger timing update) · Axcelis press release, Oct 2025

Die attach and hybrid bonding leader; Applied Materials is raising its stake to about 20%.

Sources: Besi investor relations · StockAnalysis Besi profile · Applied Materials 8-K, Oct 2026 (Besi stake)

Inspection and metrology for advanced packaging, HBM and compound semiconductors.

Sources, partly verified: StockAnalysis CAMT profile · Camtek website

Supplies i-line and KrF steppers, packaging lithography and nanoimprint lithography tools.

Sources: StockAnalysis Canon profile · Wikipedia: Canon Inc.

Exclusive supplier of EUV and DUV optics to ASML, which holds a 24.9% stake.

Sources, partly verified: Wikipedia: Carl Zeiss SMT · ZEISS SMT website

Test handlers, contactors, inspection and test equipment for back-end semiconductor test.

Sources: StockAnalysis COHU profile · Cohu 10-Q, Q3 2026

DUV excimer and EUV light sources; owned by ASML since 2013.

Sources, partly verified: Cymer website (ASML group)

Leading dicing, grinding and polishing equipment for wafer thinning and singulation.

Sources: StockAnalysis Disco profile · Wikipedia: Disco Corporation

CMP systems and dry vacuum pumps for semiconductor fabs.

Sources: StockAnalysis Ebara profile · Wikipedia: Ebara Corporation

Probe cards, including for HBM and DRAM, and engineering probe stations.

Sources: StockAnalysis FORM profile · Wikipedia: FormFactor

Thermo-compression bonders for HBM stacking plus vision placement and sawing equipment.

Sources: StockAnalysis Hanmi Semiconductor profile · Wikipedia: Hanmi Semiconductor

Hitachi group unit making electron-beam metrology (CD-SEM), defect review and etch systems.

Sources, partly verified: Wikipedia, Hitachi (Hitachi High-Tech section)

Gas and chemical fluid delivery subsystems for wafer equipment makers.

Sources: StockAnalysis ICHR profile

Korean CVD and ALD equipment maker for semiconductors, displays and solar.

Sources: StockAnalysis Jusung Engineering profile · Jusung Engineering website

Dominant process control supplier for wafer and reticle inspection, metrology and analytics.

Sources: StockAnalysis KLAC profile · Wikipedia: KLA Corporation

Batch furnace, thermal processing and batch ALD systems; former Hitachi Kokusai unit.

Sources: StockAnalysis Kokusai Electric profile · Wikipedia: Kokusai Electric

Wire bonders, advanced packaging and thermo-compression bonding equipment.

Sources: StockAnalysis KLIC profile · Kulicke & Soffa investor relations

Leading plasma etch and deposition equipment supplier, strongest in memory.

Sources: StockAnalysis LRCX profile · Wikipedia: Lam Research

Sole supplier of actinic EUV mask blank and photomask inspection systems.

Sources: StockAnalysis Lasertec profile · Wikipedia: Lasertec

Dry strip, rapid thermal processing and etch tools; owned by Beijing E-Town Dragon.

Sources: Mattson Technology website · Wikipedia: Mattson Technology

Vacuum, RF power, gas delivery, laser/optics and specialty chemistry subsystems.

Sources: StockAnalysis MKSI profile · Wikipedia: MKS Instruments

China's largest wafer equipment maker: etch, PVD/CVD, furnaces and cleaning tools.

Sources: StockAnalysis NAURA profile · NAURA website

Supplies ArF, KrF and i-line lithography steppers and scanners.

Sources: StockAnalysis Nikon profile · Wikipedia: Nikon

Optical, X-ray and chemical metrology for front-end process control.

Sources: StockAnalysis NVMI profile · Wikipedia: Nova Ltd.

Optical metrology, inspection and advanced-packaging lithography tools.

Sources: StockAnalysis ONTO profile · Wikipedia: Onto Innovation

Chinese PECVD, ALD and hybrid bonding equipment maker.

Sources: StockAnalysis Piotech profile · Wikipedia: Piotech

Global leader in single-wafer and batch wafer cleaning equipment.

Sources: StockAnalysis SCREEN Holdings profile · Wikipedia: Screen Holdings

China's main domestic lithography scanner maker for front-end and advanced packaging.

Sources: Wikipedia: Shanghai Micro Electronics Equipment

SoC and memory test equipment maker, plus Universal Robots robotics.

Sources: StockAnalysis TER profile · Wikipedia: Teradyne

Japan's largest wafer equipment maker: coater/developers, etch, deposition, cleaning and probers.

Sources: StockAnalysis Tokyo Electron profile · Wikipedia: Tokyo Electron

Family-owned laser maker supplying CO2 drive lasers for ASML EUV light sources.

Sources, partly verified: Wikipedia: Trumpf · TRUMPF company page

Gas and liquid delivery subsystems and critical parts cleaning for equipment makers.

Sources: StockAnalysis UCTT profile

Laser annealing, ion beam, MOCVD and wet processing tools; merger with Axcelis pending.

Sources: StockAnalysis VECO profile · Axcelis 8-K, Nov 2026 (merger timing update) · Axcelis press release, Oct 2025

Korean CVD, ALD and thermal process equipment supplier and key Samsung vendor.

Sources: StockAnalysis Wonik IPS profile

Glass and chemicals group and major EUV mask blank supplier.

Sources: AGC official site · StockAnalysis, TYO:5201

Industrial gases major supplying electronics carrier gases, precursors and specialty gases.

Sources: Air Liquide official site · StockAnalysis, EPA:AI

Industrial gases supplier providing on-site nitrogen and electronic gases to fabs.

Sources, partly verified: StockAnalysis, APD company profile

Food company that dominates supply of Ajinomoto Build-up Film insulator for IC substrates.

Sources: Ajinomoto Group global site · StockAnalysis, TYO:2802

European PCB and ABF substrate maker with a substrate plant in Kulim, Malaysia.

Sources: AT&S official site · StockAnalysis, VIE:ATS

Printing group making photomasks and nanoimprint templates; holds 15% of the Shinko buyout vehicle.

Sources: DNP official site · StockAnalysis, TYO:7912 · DNP news release on Shinko investment, Feb 2025

Korean photoresist and process chemical maker supplying Samsung and SK hynix.

Sources: StockAnalysis, KOSDAQ:005290 profile · Dongjin Semichem official site

Filtration, specialty chemicals, CMP slurries and pads (including CMC Materials) and wafer handling.

Sources: Entegris official site · StockAnalysis, ENTG

Fujifilm's unit for photoresists, CMP slurries, process chemicals and image-sensor color materials.

Sources, partly verified: Fujifilm global site

Specialist in CMP slurries and polishing compounds for wafers and devices.

Sources: Fujimi official site · StockAnalysis, TYO:5384

Third-largest silicon wafer maker; owns MEMC assets including a new Texas 300mm fab.

Sources: GlobalWafers official site · StockAnalysis, TPEX:6488

Optics company leading supply of EUV and advanced photomask blanks.

Sources: HOYA stock information · StockAnalysis, TYO:7741

Leading FC-BGA/ABF substrate maker for high-end CPUs and AI GPUs.

Sources: Ibiden IR stock page · StockAnalysis, TYO:4062

Leading photoresist and EUV metal-oxide resist supplier owned by JIC, which reportedly weighed a sale in 2026.

Sources, partly verified: JSR official site · Reuters via The Star, May 2026

Leading sputtering target and compound semiconductor materials maker; listed on the TSE in 2025.

Sources: JX Advanced Metals official site · JX Advanced Metals stock information (TSE Prime 5016)

ABF and BT substrate maker in the Pegatron group.

Sources: Kinsus official site · StockAnalysis, TPE:3189

LG affiliate making camera modules and FC-BGA package substrates.

Sources, partly verified: StockAnalysis, KRX:011070 profile

Largest industrial gas company, supplying bulk and electronic specialty gases to fabs.

Sources: Linde investors · StockAnalysis, LIN profile (Woking, UK)

Electronics unit supplies deposition precursors, specialty gases and patterning materials; sold Surface Solutions in 2025.

Sources: StockAnalysis, ETR:MRK profile · Merck KGaA press release, Aug 2025

Chemical maker supplying EUV pellicles and packaging tapes; holds 5% of the Shinko buyout vehicle.

Sources: Mitsui Chemicals official site · StockAnalysis, TYO:4183 · Mitsui Chemicals release on Shinko investment, Feb 2025

Formosa Plastics group ABF/BT substrate and PCB manufacturer.

Sources: Nan Ya PCB official site · StockAnalysis, TPE:8046

Parent of Taiyo Nippon Sanso and Matheson, supplying industrial and electronic gases.

Sources: Nippon Sanso official site · StockAnalysis, TYO:4091 profile

Leading independent merchant photomask maker for ICs and flat-panel displays.

Sources, partly verified: StockAnalysis, PLAB profile · Photronics Form 10-Q, FY2026

Former DuPont electronics unit making CMP pads, slurries, resists and metallization; spun off November 2025.

Sources: Qnity investor relations · StockAnalysis, Q profile (NYSE)

CMP slurries, packaging materials and specialty gases; spun off petrochemical unit Crasus Chemical in October 2026.

Sources: Resonac official site · StockAnalysis, TYO:4004 · JPX listing outline, Crasus Chemical, Sep 2026

Samsung affiliate making FC-BGA substrates, MLCCs and camera modules.

Sources: Samsung Electro-Mechanics official site · StockAnalysis, KRX:009150

World's largest silicon wafer maker; also supplies ArF/EUV photoresists, mask blanks and silicones.

Sources: Shin-Etsu official site · StockAnalysis, TYO:4063

FC-BGA substrate and lead-frame maker; taken private by a JIC-led group in 2025.

Sources: Shinko official site · StockAnalysis, TYO:6967 (delisted) · FilingReader, Apr 2025

Hyperpure silicon wafer maker; Wacker Chemie cut its stake to about 15% in 2026.

Sources: Siltronic official site · StockAnalysis, ETR:WAF · Indian Chemical News, Sep 2026

Memory module PCB and package substrate maker.

Sources: Simmtech official site (KOSDAQ: 222800) · StockAnalysis, KOSDAQ:222800

Korean silicon wafer maker; Doosan agreed in July 2026 to buy SK Inc.'s 70.6% stake.

Sources, partly verified: Dechert, Aug 2026 · Korea Times, Jul 2026

Leader in silicon-on-insulator and engineered substrates, including SmartSiC.

Sources: Soitec investors · StockAnalysis, EPA:SOI

Korean supplier of high-purity etchants, hydrofluoric acid and CMP slurries.

Sources: StockAnalysis, KOSDAQ:357780 profile · Soulbrain official site

Second-largest silicon wafer producer, focused on 300mm prime wafers.

Sources: SUMCO investor relations · StockAnalysis, TYO:3436

Diversified chemical maker supplying ArF/EUV photoresists and high-purity chemicals.

Sources: Sumitomo Chemical official site · StockAnalysis, TYO:4005

Former Toppan Photomask, a merchant photomask maker; listed on TSE Prime in October 2025.

Sources: Tekscend Photomask official site · StockAnalysis, TYO:429A profile

Top-tier photoresist maker for KrF, ArF and EUV lithography, plus high-purity chemicals.

Sources: TOK investor relations · StockAnalysis, TYO:4186

Printing and electronics group making FC-BGA substrates; largest shareholder of Tekscend Photomask.

Sources: TOPPAN Holdings official site · StockAnalysis, TYO:7911 · DealStreetAsia, 2025 (Toppan stake to 46.6%)

Largest ABF substrate maker by revenue; also makes PCBs and HDI boards.

Sources: Unimicron official site · StockAnalysis, TPE:3037

Second-largest OSAT with $6.3B 2024 revenue; building an Arizona advanced packaging campus.

Sources: StockAnalysis AMKR profile

World's largest OSAT with $18.5B 2024 revenue; parent of ASE, SPIL and USI.

Sources: StockAnalysis ASX profile · TrendForce, May 2025 (2024 OSAT ranking)

Memory and display-driver assembly and test provider.

Sources: StockAnalysis IMOS profile · StockAnalysis TPE: 8150

Korean memory-focused OSAT with plants in Vietnam and Brazil; eighth globally in 2024.

Sources: Hana Micron official site · StockAnalysis 067310 profile · Evertiq, May 2025 (OSAT ranking)

Chinese OSAT and fastest-growing top-10 player in 2024, up 26%.

Sources: StockAnalysis 002185 profile · TrendForce, May 2025 (2024 OSAT ranking)

China's largest OSAT and third-largest globally, with $5.0B 2024 revenue.

Sources: StockAnalysis 600584 profile

Largest independent IC testing house and a key AI GPU test partner.

Sources: StockAnalysis 2449 profile · Evertiq, May 2025 (OSAT ranking)

Largest memory-focused OSAT, ranked fifth globally in 2024.

Sources: StockAnalysis 6239 profile

Major OSAT with CoWoS-like and fan-out packaging capacity, wholly owned by ASE.

Sources, partly verified: SPIL official site

Chinese OSAT ranked fourth globally and a major AMD packaging partner.

Sources: StockAnalysis 002156 profile · eeNews Europe, 2025 (TFME ranked 4th)

System-in-package and electronics manufacturing arm majority-owned by ASE.

Sources: StockAnalysis 601231 profile

Investment group owning UTAC and other OSAT assets; seventh-largest OSAT in 2024.

Sources, partly verified: Wise Road Capital site · Bloomberg, Sep 2025 (UTAC sale process)

Taiwanese PC brand making notebooks, desktops, monitors and some servers.

Sources: Wikipedia (TWSE: 2353)

Designs Macs and other devices on in-house Apple silicon chips.

Sources: Wikipedia (Nasdaq: AAPL) · Apple investor relations

High-speed Ethernet switching and routing for cloud and AI data centers.

Sources: Arista investor relations

PC, motherboard and graphics-card brand that also sells AI servers.

Sources: Wikipedia (TWSE: 2357)

Largest networking equipment vendor, also selling UCS servers and AI data-center switching.

Sources: Cisco investor relations

Largest server vendor by revenue, also selling PCs, storage and AI rack systems.

Sources: Dell investor relations

All-flash storage and data-management vendor; renamed from Pure Storage in February 2026.

Sources: Everpure website (NYSE: P) · Everpure press release, Apr 2026 · Techzine, Feb 2026

Japanese IT group making servers, supercomputers and Arm-based Monaka CPUs.

Sources: Wikipedia (TSE: 6702; website global.fujitsu)

Motherboard and graphics-card maker whose Giga Computing unit builds GPU servers and AI racks.

Sources: Wikipedia (TWSE: 2376; Giga Computing subsidiary)

Servers, storage, HPC supercomputers and networking; completed its Juniper Networks acquisition in July 2025.

Sources: HPE investor relations · Wikipedia (Juniper closed Jul 2, 2025)

Major PC and printer maker.

Sources: Wikipedia (NYSE: HPQ)

Makes IBM Z mainframes, Power servers and storage alongside software and consulting.

Sources: Wikipedia (NYSE: IBM)

China's largest server maker and the listed arm of Inspur Group.

Sources: IEIT Systems website (SZ000977)

World's largest PC maker and a top-three server vendor by revenue.

Sources: Wikipedia (SEHK: 992)

Gaming PC, motherboard and graphics-card maker expanding into servers.

Sources: StockAnalysis, TPE:2377 · Wikipedia

Japanese IT and networking group making servers, vector supercomputers and telecom equipment.

Sources: Wikipedia (TYO: 6701)

Enterprise data-storage systems and data-management software for hybrid cloud and AI.

Sources: Wikipedia (Nasdaq: NTAP)

Designs, builds and manages HPC and AI clusters; renamed from SMART Global Holdings in 2024.

Sources: Wikipedia (Nasdaq: PENG) · Penguin Solutions investor relations

Chinese HPC and server maker; its planned Hygon merger collapsed in December 2025.

Sources: Sugon website (SSE 603019) · The Register, Dec 2025

Server and rack-scale AI system maker; second-largest server vendor by 2025 revenue.

Sources: Wikipedia (Nasdaq: SMCI)

Former Huawei x86 server business and major Chinese server vendor, preparing an IPO.

Sources, partly verified: xFusion website · Light Reading (IPO prep)

Electronics manufacturer building switches, servers and storage for hyperscalers.

Sources: Celestica official site · Wikipedia: Celestica · StockAnalysis: CLS

Major notebook ODM expanding into servers and AI server racks.

Sources: Compal official site · Wikipedia: Compal Electronics

Precision optical and electronic contract manufacturer and key builder of AI optical transceivers.

Sources, partly verified: Fabrinet official site · StockAnalysis: FN profile · StockAnalysis: FN (Bangkok press datelines)

Contract manufacturer planning to spin off its data-center power and cloud unit as Axiom (Nasdaq: AXM).

Sources: Flex investor relations · Flex EGM proxy statement, Oct 2026

World's largest electronics manufacturer and leading assembler of NVIDIA GB200/GB300 AI racks.

Sources: Hon Hai official site · Wikipedia: Foxconn

Server and notebook ODM supplying hyperscale and AI servers and motherboards.

Sources: Inventec official site · Wikipedia: Inventec

Global contract manufacturer with a fast-growing cloud and data-center infrastructure business.

Sources: Jabil investor relations

Apple assembler expanding into AI server cables, connectors, power and racks; Hong Kong-listed July 2026.

Sources: Luxshare official site · The Standard (HK), Jul 2026 · FilingReader, Jul 2026

Server ODM and OEM, including former Intel and Tyan server lines, plus embedded computing.

Sources: MiTAC official site · Wikipedia: MiTAC · StockAnalysis: TPE 3706 profile

Electronics ODM building consumer electronics and, increasingly, AI servers.

Sources: Pegatron official site · Wikipedia: Pegatron

Leading notebook and AI server ODM whose QCT unit sells cloud servers to hyperscalers.

Sources: Quanta official site · Wikipedia: Quanta Computer

Electronics manufacturing services firm; bought ZT Systems' rack manufacturing business from AMD in October 2025.

Sources: Sanmina official site (ZT Systems acquisition banner) · Sanmina investor relations

Electronics ODM making notebooks, servers, NVIDIA GPU baseboards and AI servers.

Sources: Wistron official site · Wikipedia: Wistron

Wistron-affiliated cloud server and rack ODM serving hyperscale data centers.

Sources: Wiwynn official site · Wikipedia: Wiwynn

Connectors, cables and interconnect, including copper backplane cabling for AI racks.

Sources: Amphenol official site · Wikipedia: Amphenol · StockAnalysis: APH profile

Thermal-module maker and major supplier of liquid-cooling cold plates for AI servers.

Sources: Wikipedia: Asia Vital Components

Optical transceivers, lasers and SiC substrates for data-center and AI networking.

Sources: Coherent official site · Wikipedia: Coherent Corp. · StockAnalysis: COHR profile

Leading server power-supply and data-center power and thermal solutions maker.

Sources: Delta Electronics official site · Wikipedia: Delta Electronics

Chengdu-based high-speed 800G/1.6T optical transceiver maker; filed for a Hong Kong listing in 2026.

Sources: Eoptolink investors page · TNW, Jul 2026 · FilingReader, Jun 2026

Server power supplies, battery backup units and optoelectronics for data centers.

Sources: LITEON official site · Wikipedia: Lite-On

Lasers, transceivers and photonic components for cloud and AI networks.

Sources: Lumentum investor relations · Wikipedia: Lumentum · StockAnalysis: LITE profile

Energy-management group supplying data-center power, UPS and liquid cooling via a controlling stake in Motivair.

Sources: Schneider Electric official site · Wikipedia: Schneider Electric

Leading hard-disk-drive maker of high-capacity HAMR drives for cloud and AI storage.

Sources: Seagate investor relations · Wikipedia: Seagate Technology · StockAnalysis: STX profile

Connectors and sensors, including high-speed data-center interconnect for AI systems.

Sources: TE Connectivity FY2025 Form 10-K

Data-center power, thermal and liquid-cooling infrastructure supplier.

Sources: Vertiv investor relations · Wikipedia: Vertiv · StockAnalysis: VRT profile

Hard-disk-drive maker after spinning off its flash business as SanDisk in February 2025.

Sources: Western Digital official site · Wikipedia: Western Digital · StockAnalysis: WDC profile

World's largest high-speed optical transceiver maker; added a Hong Kong listing in July 2026.

Sources: InnoLight official site · LEDinside, Jul 2026 · Law.asia, Jul 2026